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We are a
LEAD FREE
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Technologies
- Double-Sided: 10%
- Multi-layer: 90%
- Flex circuits
- Exotic Materials
- Impedance controlled
- Blind / buried vias
- All production processes done in house
- Conductive and Non-Conductive Via Fill
Lead Times
- Single / Double sided: Same day
- 1-8 layers: 24 hrs
- 8-18 layers: 48 hrs
- 3, 5, 7, 10, 15, 20 day turn options
- Standard delivery: 3 weeks
Plating- Finished copper: 1-6 oz
- Gold Plating: .00003”
- Nickel Plating: .000100”
Finishes
- Hot air leveled solder
- Immersion Silver
- Immersion gold
- ENIG
- Electrolytic hard gold
- Carbon ink
(for EPA reasons we are a lead-free facility)
Drilling
- Smallest hole size drilled: .010
- Smallest hole size finished: .005-.006 plated
- Hole to board edge tol: +/- .005
- Second Stage hole to first stage hole tol: +/- .005
- Routing board edge tol: +/- .003
Image
- Minimum line width and spacing UL approved to .004
- Hole-to-pad registration tol:.004
- LPI Mask
Colors: Green, Red, Blue, Black, Yellow, White, Clear - LPI Silk
Colors: White, Green, Red, Blue, Black, Yellow - Dry Film Solder Mask
- Thermal Solder Mask
Materials
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Capabilities
